Defect Inspection & Review | Chip Manufacturing | KLA

Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back ... Byusingthissite,youagreetoourupdatedPrivacyPolicyandourCookiePolicy. CookieSettings IAccept Close CookieSettings Thiswebsiteusescookiestoimproveyourexperiencewhileyounavigatethroughthewebsite.Outofthesecookies,thecookiesthatarecategorizedasnecessaryarestoredonyourbrowserastheyareessentialfortheworkingofbasicfunctionalitiesofthewebsite.Wealsousethird-partycookiesthathelpusanalyzeandunderstandhowyouusethiswebsite.Thesecookieswillbestoredinyourbrowseronlywithyourconsent.Youalsohavetheoptiontoopt-outofthesecookies.Butoptingoutofsomeofthesecookiesmayhaveaneffectonyourbrowsingexperience. Essential AlwaysEnabled Essentialcookieshelpthewebsitefunctionbyenablingfunctionalityandrememberinguserchoices.Thewebsitewillnotfunctionproperlywithoutthem. 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ContactUs eSL10™ e-BeamPatternedWaferDefectInspectionSystem TheeSL10™electron-beam(e-beam)patternedwaferdefectinspectionsystemleveragestheindustry’shighestlandingenergyandhighresolutiontocapturesmallphysicalandhighaspectratiodefects,supportingprocessdevelopmentandproductionmonitoringforadvancedlogic,DRAMand3DNANDdevices.Withaninnovativeelectronopticsdesign,theeSL10™produceshighbeamcurrentdensityatasmallspotsizeandtheindustry’swidestrangeofoperatingconditionsfordefectcaptureacrossanarrayofchallengingprocesslayersanddevicestructures.RevolutionaryYellowstone™scanningmodesupportshighspeedoperationwithoutcompromisingresolution,forefficientinvestigationofsuspectedhotspotsordefectdiscoverywithinabroadchiparea.Industry-uniqueSimul-6™technologyprovidessurface,topographic,materialcontrastanddeeptrenchinformationinasinglescan,reducingthetimerequiredtocollectcompleteinformationonavarietyofdefecttypes.WithintegratedArtificialIntelligence(AI),theeSL10employsSMARTs™deeplearningalgorithmsthatdiscriminatekeyDOIsfrompatternandprocessnoise,enablingcaptureandclassificationofcriticaldefectsduringR&Dandramp. ApplicationsHighresolutiondefectcapture,Defectdiscovery,R&Dprocessdebug,Engineeringanalysis,RampandlinemonitoringRelatedProductseDR7xxx™:Electron-beamwaferdefectreviewandclassificationsystemfor≤10nmdesignnodeICdevelopmentandproduction.TheeDR7xxx™providesuniquelinkagetoKLAinspectorsforfasteryieldlearningduringICandwafermanufacturing. Interestedinthisproductorhavequestions? ContactUs ShowDetails 39xx Interestedinthisproductorhavequestions? ContactUs 39xx SuperResolutionBroadbandPlasmaPatternedWaferDefectInspectionSystems The392xSeriesbroadbandplasmadefectinspectionsystemssupportwafer-leveldefectdiscovery,yieldlearningandinlinemonitoringfor≤7nmlogicandleading-edgememorydesignnodes.Withlightsourcetechnologythatproducessuperresolutiondeepultraviolet(SR-DUV)wavelengthbandsandsensorinnovations,the3920and3925providehighsensitivitycaptureofuniquedefecttypes.The392xSeriesalsoleveragesadvanceddesign-awarealgorithms,pixel•point™andnano•cell™,tocaptureandbindefectsinyield-criticalpatternlocations.Withthroughputthatsupportsinlinemonitoringrequirements,the392xSeriespairssensitivitywithspeed,enablingDiscoveryattheSpeedofLight™,forreductionofthetimerequiredtodeliverwafer-leveldataforcompletecharacterizationofprocessissuesduringdevelopmentandhighvolumemanufacturing. ApplicationsDefectdiscovery,Hotspotdiscovery,Processdebug,EUVprintcheck,Engineeringanalysis,Linemonitoring,ProcesswindowdiscoveryRelatedProducts3900and3905:Opticalbroadbandplasmawaferdefectinspectorsthatprovideyield-criticaldefectcaptureon10nmandbelowlogicandadvancedmemorydevices.29xxSeries:Opticalbroadbandplasmawaferdefectinspectorsthatcomplementtheinspectionperformanceofthe39xxSeriesfordefectdiscoveryonarangeofdesignnodesanddevicetypes. Interestedinthisproductorhavequestions? ContactUs ShowDetails 29xx Interestedinthisproductorhavequestions? ContactUs 29xx BroadbandPlasmaPatternedWaferDefectInspectionSystems The295xSeriesbroadbandplasmadefectinspectionsystemsprovideadvancementsinopticaldefectinspection,enablingdiscoveryofyield-criticaldefectson≤7nmlogicandleading-edgememorydesignnodes.Usingenhancedbroadbandplasmailluminationtechnology,andthenewpixel•point™andnano•cell™design-awaretechnologies,the2950and2955broadbandplasmadefectinspectorsprovidethesensitivityrequiredtocapturecriticaldefectsacrossarangeofprocesslayers,materialtypesandprocessstacks.Astheindustry-standardforinlinemonitoring,the295xSeriespairssensitivitywithopticalwaferdefectinspectionspeed,enablingDiscoveryattheSpeedofLight™–thecombinationoffastdefectdiscoveryandfullcharacterizationofdefectissuesatoptimalcostofownership. ApplicationsDefectdiscovery,Hotspotdiscovery,Processdebug,Engineeringanalysis,Linemonitoring,ProcesswindowdiscoveryRelatedProducts39xxSeries:Opticalbroadbandplasmawaferdefectinspectorswithsuperresolutiondeepultraviolet(SR-DUV)wavelengthbandsthatcomplementtheinspectionperformanceofthe29xxSeriesfordefectdiscoveryon≤10nmdesignnodedevices.2930and2935:Opticalbroadbandplasmawaferdefectinspectorsthatprovideyield-criticaldefectcaptureon10nmandbelowlogicandadvancedmemorydevices.2920and2925:Opticalbroadbandplasmawaferdefectinspectorsthatprovideyield-criticaldefectcaptureon16nmandbelowmemoryandlogicdevices.2910and2915:Opticalbroadbandplasmawaferdefectinspectorsthatprovideyield-relevantdefectcaptureon2X/1Xnmmemoryandlogicdevices.2900and2905:Opticalbroadbandplasmawaferdefectinspectorsthatprovidecaptureofyield-relevantdefectson2Xnmmemoryandlogicdevices. Certified&Remanufactured Interestedinthisproductorhavequestions? ContactUs ShowDetails C205 Interestedinthisproductorhavequestions? ContactUs C205 BroadbandPlasmaPatternedWaferDefectInspectionSystem TheC205broadbandplasmaopticaldefectinspectionsystemenablessystematicdefectdiscoveryandlatentreliabilitydefectdetectionforchipmanufacturingfortheautomotive,IoT,5Gandconsumerelectronicsmarkets.TheC205leveragesatunablebroadbandilluminationsource,advancedopticsandalownoisesensortocapturesystematicdefects,helpingacceleratecharacterizationandoptimizationofnewprocesses,designnodesanddevicesduringR&D.NanoPoint™technologyfocusesinspectiononpatternareasathighriskforreliabilityfailures,deliveringactionabledefectdatathathelpsreducedieoverkill.Inproduction,theC205monitorscriticallayersrequiringhighsensitivity,helpingfabsavoiddefectexcursionsthataffectfinalchipquality.TheC205isanextendible,configurableplatformsupportingboth200mmand300mmwafersizes. ClickheretodownloadtheC205productbrochure. ApplicationsDefectdiscovery,Hotspotdiscovery,Processdebug,Engineeringanalysis,Linemonitoring,ProcesswindowdiscoveryRelatedProducts39xxSeries:Opticalbroadbandplasmawaferdefectinspectorswithsuperresolutiondeepultraviolet(SR-DUV)wavelengthbandsthatcomplementtheinspectionperformanceofthe29xxSeriesfordefectdiscoveryon≤10nmdesignnodedevices. 29xxSeries:Opticalbroadbandplasmawaferdefectinspectorsthatprovidecaptureofyieldandreliability-relateddefectsforlogicdevicesrangingfrom5nm–2Xnmandadvancedmemorydevices. Interestedinthisproductorhavequestions? ContactUs ShowDetails Voyager® Interestedinthisproductorhavequestions? ContactUs Voyager® LaserScanningPatternedWaferDefectInspectionSystems TheVoyager®1035laserscanninginspectionsystemsupportsproductionrampdefectmonitoringforadvancedlogicandmemorychipmanufacturing.TheVoyager1035inspectorwithDefectWise®deeplearningalgorithm,separateskeyDOI(DefectsOfInterest)frompatternnuisancedefectstoimprovetheoveralldefectcapturerateofthedefectsthatmatter,includingunique,subtledefects.Industry-uniqueobliqueilluminationandnewsensorswitha30%improvementinquantumefficiencyproducehigherthroughputandbettersensitivityforlowerdoseinspectionofdelicatephotoresistlayersinapplicationssuchasafterdevelopinspection(ADI)andphotocellmonitoring(PCM)forEUVlithography.TheVoyager1035delivershighthroughputandsensitivitycombinedwithdeeplearningcapabilitytocapturecriticaldefectsinthelithocellandothermodulesofthefaballowingprocessissuestobeidentifiedandrectifiedrapidly. ApplicationsLinemonitor,Toolmonitor,Toolqualification,193iandEUVresistqualificationRelatedProductsVoyager®1015 Interestedinthisproductorhavequestions? ContactUs ShowDetails 8Series Interestedinthisproductorhavequestions? ContactUs 8Series HighProductivityPatternedWaferBroadRangeInspectionSystems The8Seriespatternedwaferinspectionsystemsdetectawidevarietyofdefecttypesatveryhighthroughputforfastidentificationandresolutionofproductionprocessissues.The8Seriesprovidescost-effectivedefectmonitoringfor150mm,200mmor300mmsiliconandnon-siliconsubstratesfrominitialproductdevelopmentthroughvolumeproduction.Thelatestgeneration8935inspectoremploysnewopticaltechnologiesandDesignWise®andFlexPoint™preciseareainspectiontechniquestocapturecriticaldefectsthatcancausechipfailures.DefectWise®AItechnologyenablesfast,inlineseparationofdefecttypesforimproveddefectdiscoveryandbinning.Withtheseinnovations,the8935supportshighproductivitycaptureofyieldandreliability-relateddefectsatalownuisancerate,helpingbothleading-edgeandlegacynodefabsacceleratedeliveryoftheirproducts—reliablyandatlowercost. WanttolearnmoreabouttheI-PAT®automated,inlinediescreeningsolutionfor8Series?Clickhere. Clickheretodownloadthe8930factsheetforSiC/GaNsemiconductors. ApplicationsProcessmonitor,Toolmonitor,OutgoingQualityControl(OQC)RelatedProductsCIRCL:The8SeriesinspectiontechnologyisalsoavailableasamoduleontheCIRCLdefectinspection,metrologyandreviewclustertooldesignedforall-surfacewafermeasurementsofthefrontside,backsideandedge. Interestedinthisproductorhavequestions? ContactUs ShowDetails Puma™ Interestedinthisproductorhavequestions? ContactUs Puma™ LaserScanningPatternedWaferDefectInspectionSystems ThePuma™9980laserscanninginspectionsystemincorporatesmultiplesensitivityandspeedenhancementsthatenablecaptureofcriticaldefectsofinterest(DOI)atthroughputsrequiredforhighvolumemanufacturingfor1XnmadvancedlogicandadvancedDRAMand3DNANDmemorydevices.Partofaportfolioofadvancedwaferdefectinspectionandreviewtools,thePuma9980providesthehighestthroughputsolutionforproductionrampmonitoringbyenhancingcaptureofdefecttypesonadvancedpatterninglayers.ThePuma9980incorporatesNanoPoint™design-awarecapability,whichproducesmoreactionableinspectionresultsthroughincreaseddefectsensitivity,improvedsystematicnuisancebinningandtighteneddefectcoordinateaccuracy. WanttolearnmoreabouttheI-PAT®automated,inlinediescreeningsolutionforPuma9980andPuma9850?Clickhere. ApplicationsLinemonitor,Toolmonitor,ToolqualificationRelatedProductsPuma9850:Provideshighsensitivityexcursionmonitoringinalldieregionsfor2X/1Xnmmemoryandlogicdevices.Puma9650:Provideshighperformanceexcursionmonitoringinalldieregionsfor≤28nmmemoryandlogicdevices.Puma9500:Provideshighperformanceexcursionmonitoringfor≤32nmmemoryandlogicdevices. Certified&Remanufactured Interestedinthisproductorhavequestions? ContactUs ShowDetails CIRCL™ Interestedinthisproductorhavequestions? ContactUs CIRCL™ All-SurfaceWaferDefectInspection,MetrologyandReviewClusterSystem TheCIRCL™clustertoolhasfourmodules,coveringallwafersurfacesandprovidingparalleldatacollectionathighthroughputforefficientprocesscontrol.Themodulescomprisingthelatest-generationCIRCL5systeminclude:frontsidewaferdefectinspection;waferedgedefectinspection,profile,metrologyandreview;backsidewaferdefectinspectionandreview;and,opticalreviewandclassificationoffrontsidedefects.DatacollectioniscontrolledbyDirectedSampling™,aninnovativeapproachthatusesresultsfromonemeasurementtotriggerothertypesofmeasurementswithinthecluster.ThemodularconfigurationofCIRCL5offersflexibilityforvaryingprocesscontrolneeds,savesoverallfabspace,reduceswaferqueuetime,andprovidesacost-effectiveupgradepathtoprotectafab'scapitalinvestment. ApplicationsProcessmonitor,OutgoingQualityControl(OQC),Toolmonitor,Backsidemonitor,Edgeyieldmonitor Interestedinthisproductorhavequestions? ContactUs ShowDetails Surfscan® Interestedinthisproductorhavequestions? ContactUs Surfscan® UnpatternedWaferDefectInspectionSystems TheSurfscan® SP7XPunpatternedwaferinspectionsystemidentifiesdefectsandsurfacequalityissuesthataffecttheperformanceandreliabilityofleading-edgelogicandmemorydevices.ItsupportsIC,OEM,materialsandsubstratemanufacturingbyqualifyingandmonitoringtools,processesandmaterials,includingthoseusedforEUVlithography.UsingaDUVlaserandoptimizedinspectionmodes,theSurfscanSP7XPdeliversultimatesensitivityforadvancednodeR&Dandthethroughputtosupporthighvolumemanufacturing.Complementarydetectionmodes,includingthephasecontrastchannel(PCC)andnormalillumination(NI),detectuniquedefecttypesforbarewafers,smoothandroughfilms,andfragileresistsandlithostacks.Imagebaseddefectclassification(IBC)usingrevolutionarymachinelearningalgorithmssupportfastertimetorootcause,whiletheZ7™classificationenginesupportsunique3DNANDandthickfilmapplications. ClickheretodownloadtheSurfscanSP7XPbrochure. ApplicationsProcessqualification,Toolqualification,Toolmonitoring,Outgoingwaferqualitycontrol,Incomingwaferqualitycontrol,EUVresistandscannerqualification,ProcessdebugRelatedProductsSurfServer®:RecipemanagementsystemthatfacilitatesrecipeportabilitybetweencompatibleSurfscansystems,helpingstreamlinefleetmanagementwithinfabs. SurfscanSP7: UnpatternedwafersurfaceinspectionsystemwithDUVsensitivityandhighthroughputforIC,substrateandequipmentmanufacturingatthesub1Xnmdesignnodes. SurfscanSP5XP: UnpatternedwafersurfaceinspectionsystemwithDUVsensitivityandhighthroughputforIC,substrateandequipmentmanufacturingatthe1Xnmdesignnodes. SurfscanSP5: UnpatternedwafersurfaceinspectionsystemwithDUVsensitivityandhighthroughputforIC,substrateandequipmentmanufacturingatthe2X/1Xnmdesignnodes. SurfscanSP3: UnpatternedwaferinspectionsystemwithDUVsensitivityandhighthroughputforIC,substrateandequipmentmanufacturingatthe2Xnmdesignnode. Certified&Remanufactured Interestedinthisproductorhavequestions? ContactUs ShowDetails Surfscan®SPAx Interestedinthisproductorhavequestions? ContactUs Surfscan®SPAx UnpatternedWaferDefectInspectionSystem TheSurfscan®SPA2andSurfscan®SPA3unpatternedwaferinspectionsystemsidentifydefectsandwafersurfacequalityissuesthataffecttheperformanceandreliabilityofchipsmanufacturedfortheautomotive,IoT,5G,consumerelectronics,andindustrial(military,aerospace,medical)applications.TheseinspectionsystemssupportIC,OEM,materialsandsubstratemanufacturingbyqualifyingandmonitoringtools,processesandmaterials.UsingaDUVlaserandoptimizedinspectionmodes,theSurfscanSPAxsystemsdeliverthesensitivityrequiredtosupportfabsdefectreductionstrategies.Standarddarkfieldandoptionalbrightfieldinspectionmodesrunconcurrently,enablingcaptureandclassificationofyieldcriticalandlatentreliabilitydefecttypes.Builtontheindustry-leadingSurfscanplatform,theSurfscanSPA2/A3inspectorssupport150mm,200mmand300mmwafers,andareconfigurableandflexibletomeetthecostandperformancetargetsforarangeofapplications. ClickheretodownloadtheSurfscanSP3/Axbrochure. ApplicationsProcessqualification,Toolqualification,Toolmonitoring,Outgoingwaferqualitycontrol,Incomingwaferqualitycontrol,ProcessdebugRelatedProductsSurfServer®:RecipemanagementsystemthatfacilitatesrecipeportabilitybetweencompatibleSurfscansystems,helpingstreamlinefleetmanagementwithinfabs. SurfscanSP7XP:UnpatternedwafersurfaceinspectionsystemwithDUVsensitivityandhighthroughputforIC,substrateandequipmentmanufacturingatthesub5nmdesignnodes. SurfscanSP7:UnpatternedwafersurfaceinspectionsystemwithDUVsensitivityandhighthroughputforIC,substrateandequipmentmanufacturingatthesub1Xnmdesignnodes. SurfscanSP5XP:UnpatternedwafersurfaceinspectionsystemwithDUVsensitivityandhighthroughputforIC,substrateandequipmentmanufacturingatthe1Xnmdesignnodes. SurfscanSP5:UnpatternedwafersurfaceinspectionsystemwithDUVsensitivityandhighthroughputforIC,substrateandequipmentmanufacturingatthe2X/1Xnmdesignnodes. SurfscanSP3:UnpatternedwaferinspectionsystemwithDUVsensitivityandhighthroughputforIC,substrateandequipmentmanufacturingatthe2Xnmdesignnode. Certified&Remanufactured Interestedinthisproductorhavequestions? ContactUs ShowDetails eDR7xxx™ Interestedinthisproductorhavequestions? ContactUs eDR7xxx™ e-BeamWaferDefectReviewandClassificationSystems TheeDR7380™electron-beam(e-beam)waferdefectreviewandwaferclassificationsystemcaptureshighresolutionimagesofdefects,producinganaccuraterepresentationofthedefectpopulationonawafer.WithawiderangeofelectronopticsandadedicatedIn-LensDetector,theeDR7380supportsdefectvisualizationacrossprocesssteps,includingfragileEUVlithographylayers,highaspectratiotrenchlayersandvoltagecontrastlayers.UniqueSimul-6™technologyproducesacompleteDOIparetoinonetestforaccuratedefectsourcingandfasterexcursiondetection.Withconnectivityfeatures,suchasIAS™forbroadbandopticalpatternedwaferinspectorsandOptiSens™forbarewaferinspectors,theeDR7380providesuniquelinkagetoKLAinspectorsforfasteryieldlearningduringICandwafermanufacturing. ApplicationsDefectimaging,Automaticinlinedefectclassificationandperformancemanagement,Barewaferoutgoingandincomingqualitycontrol,Waferdispositioning,Hotspotdiscovery,Defectdiscovery,EUVprintcheck,Processwindowdiscovery,Processwindowqualification,Beveledgereview.RelatedProductseDR7280:Electron-beamwaferdefectreviewandclassificationsystemwithfifth-generatione-beamimmersionopticsfor≤16nmdesignnodeICdevelopmentandproduction. Certified&Remanufactured eDR®isaregisteredtrademarkofKLACorporation. Interestedinthisproductorhavequestions? ContactUs ShowDetails Readytogetstarted? ContactUs Areyousure? You'veselectedtoviewthissitetranslatedbyGoogleTranslate.KLAChinahasthesamecontentwithimprovedtranslations. WouldyouliketovisitKLAChinainstead? 您已选择查看由Google翻译翻译的此网站。

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