Wafer Inspection and Metrology for Advanced Packaging | KLA

Wafer Inspection and Metrology for Advanced Packaging. KLA's wafer inspection and metrology systems for advanced wafer-level packaging provide the data ... Byusingthissite,youagreetoourupdatedPrivacyPolicyandourCookiePolicy. CookieSettings IAccept Close CookieSettings Thiswebsiteusescookiestoimproveyourexperiencewhileyounavigatethroughthewebsite.Outofthesecookies,thecookiesthatarecategorizedasnecessaryarestoredonyourbrowserastheyareessentialfortheworkingofbasicfunctionalitiesofthewebsite.Wealsousethird-partycookiesthathelpusanalyzeandunderstandhowyouusethiswebsite.Thesecookieswillbestoredinyourbrowseronlywithyourconsent.Youalsohavetheoptiontoopt-outofthesecookies.Butoptingoutofsomeofthesecookiesmayhaveaneffectonyourbrowsingexperience. Essential AlwaysEnabled Essentialcookieshelpthewebsitefunctionbyenablingfunctionalityandrememberinguserchoices.Thewebsitewillnotfunctionproperlywithoutthem. 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Kronos™1190 Interestedinthisproductorhavequestions? ContactUs Kronos™1190 Wafer-LevelPackagingInspectionSystems TheKronos™1190patternedwaferinspectionsystemwithhighresolutionopticsprovidesbestinclasssensitivitytocriticaldefectsforprocessdevelopmentandproductionmonitoringinadvancedwafer-levelpackaging(AWLP)applicationsincluding3DICandhigh-densityfan-out(HDFO).DefectWise®integratesArtificialIntelligence(AI)asasystemlevelsolution,deliveringalargeboostinsensitivity,productivityandclassificationaccuracytoaddressthechallengesofoverkillanddefectescapes.DesignWise®refinestheFlexPoint™preciselytargetedinspectionareaswithdirectdesigninputtofurtherreducenuisance.Supportingbonded,thinned,warpedanddicedsubstrates,theKronos1190systemenablescost-effectivedefectinspectiondownto150nmincriticalprocessstepslikepost-dicing,pre-bonding,patterningofCupads,Cupillars,bumps,throughsiliconvias(TSVs)andredistributionlayers(RDL). ApplicationsDefectdiscovery,Processdebug,Processmonitor,Toolmonitor,OutgoingQualityControl(OQC) RelatedProductsCIRCL-AP:TheKronosinspectiontechnologyisalsoavailableasamoduleontheCIRCLdefectinspection,metrologyandreviewclustertool. Interestedinthisproductorhavequestions? ContactUs ShowDetails CIRCL™-AP Interestedinthisproductorhavequestions? ContactUs CIRCL™-AP All-SurfaceWaferDefectInspection,MetrologyandReviewClusterSystem CIRCL™-APisaclustertoolwithmultiplemodules,coveringall-surfaceinspection,metrologyandreviewathighthroughputforefficientadvancedwafer-levelpackaging(AWLP)processcontrol.TheCIRCL-APtoolisutilizedformultipleAWLPapplicationsrequiringhighsensitivityincluding2.5D/3Dintegration,wafer-levelchipscalepackaging(WLCSP)andfan-outwafer-levelpackaging(FOWLP).Withsupportforbonded,thinnedandwarpedsubstrates,CIRCL-APprovidesproduction-provenprocesscontrolandmonitoringstrategiesforCu-pillars,bumps,throughsiliconvias(TSVs),redistributionlayer(RDL)andotherpackagingprocessflows. ApplicationsProcessmonitor,OutgoingQualityControl(OQC),Toolmonitor,Backsidemonitor,Edgeyieldmonitor,Processtoolqualification Interestedinthisproductorhavequestions? ContactUs ShowDetails Zeta™-5xx/6xx Interestedinthisproductorhavequestions? ContactUs Zeta™-5xx/6xx AdvancedPackagingMetrologySystems TheZeta™-5xxSeriesopticalprofilersarefullyautomated300mmwafermetrologysystemscapableofmeasuringavarietyofapplicationssuchasbumpheight,RDL(redistributionlayer)CD,UBM(underbumpmetallization)stepheight,filmthicknessandwaferbow,whicharecriticaltoprocesscontrolinadvancedwafer-levelpackaging.Multi-modeopticssavetimeandreducecostbyenablingawidevarietyofmeasurementtypesonthesinglesystem,whiletheresultinghighresolution3Dimagesandanalysisprovidethedatarequiredtoenableprocessfeedbackcyclestodriveyieldimprovement.Forpanelbasedwafer-levelpackagingapplications,automatedpanelhandlingisavailableontheZeta™-6xxSeriesprofilers,whichofferthesamemetrologymeasurementcapabilityasthe5xxSeries. ApplicationsProcessmonitor,OutgoingQualityControl(OQC),Toolmonitor Interestedinthisproductorhavequestions? ContactUs ShowDetails Klarity® Interestedinthisproductorhavequestions? ContactUs Klarity® AutomatedDefectandYieldDataAnalysis Klarity®Defectautomateddefectanalysisanddatamanagementsystemhelpsfabsachievefasteryieldlearningcyclesthroughreal-timeexcursionidentification.Klarity®SSA(SpatialSignatureAnalysis)analysismoduleforKlarityDefectprovidesautomaticdetectionandclassificationofdefectsignaturesthatindicateprocessissues.Klarity®ACEXPadvancedyieldanalysissystemhelpsfabscapture,retainandshareyieldlearningwithinandacrossfabsforyieldacceleration.Klaritysystemsutilizeanintuitivedecisionflowanalysis,allowingengineerstoeasilycreatecustomizedanalysesthatsupportapplicationssuchaslotdispositioning,reviewsampling,defectsourceanalysis,SPCsetupandmanagement,andexcursionnotifications.KlarityDefect,KlaritySSAandKlarityACEXPformafab-wideyieldsolutionthatautomaticallyreducesdefectinspection,classificationandreviewdatatorelevantroot-causeandyield-analysisinformation.KlaritydatahelpsIC,packaging,compoundsemiandHDDmanufacturerstakecorrectiveactionsooner,resultinginacceleratedyieldandbettertimetomarket. ApplicationsDefectdataanalysis,Waferdisposition,Processandtoolexcursionidentification,Spatialsignatureanalysis,Yieldanalysis,Yieldprediction Interestedinthisproductorhavequestions? ContactUs ShowDetails Readytogetstarted? ContactUs Areyousure? You'veselectedtoviewthissitetranslatedbyGoogleTranslate.KLAChinahasthesamecontentwithimprovedtranslations. WouldyouliketovisitKLAChinainstead? 您已选择查看由Google翻译翻译的此网站。

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