UBM
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延伸文章資訊
- 1扇出型封裝| 日月光集團 - ASE Group
... which is then molded and followed by a redistribution layer (RDL) atop the molded area (chip ...
- 2饒建奇博士重分佈層之避障繞線 - 淡江大學機構典藏
重分佈層(RDL,Redistribution Layer)目前多使用在覆晶技術(Flip-. Chip)上,而覆晶技術是一種將IC 與基板(substrate)相互連接,基於小尺寸. 晶片、高...
- 3Solder Bump 製程應用在Wafer Level CSP RDL 結構可靠度 ...
- 4Re: [請益] 半導體封裝- 精華區Tech_Job - 批踢踢實業坊
Redistribution layer:我查詢後感覺是一種重新分配電路的技術,把原本: 在周圍的Bond pad改到整各元件的面上。我的問題是這不過就是多加幾道: ...
- 5晶圓級封裝凸塊介電層製程技術之改進 - 高雄應用科技大學
(Cu RDL)技術中,此製程的第一層Polymer 厚度(5 或7.5um),第二層Polymer 厚度(5 ... 圖1.4 Plating(Cu RDL)產品之Bumping 製程結構流程...