覆晶封裝 - 弘塑科技股份有限公司

PVD systems are used to deposit Under Bump. Metallization (UBM) layers to enable bump metals to a...

As Fig.1.9 shown , RDL layer is placen between two dielectric layers on the wafer . 8. Page 19. S...

... Bump)兩部份；在UBM 的進階製程裡則引進線路重佈技術(RDL ：Redistribution Layer)以調整元件的I/O 位置，進而提升元件的結構穩定性。

製程時，因電鍍銅的線路與重新塗佈聚合物介電層（Polymer Dielectric layer）間 ... 圓凸塊（Wafer Bumping），就凸塊製程而言，其主要包括球下金屬層（UBM：.

What is UBM? Under bump metallization – or UBM – is an advanced packaging process that involves c...