Redistribution Layers (RDLs) - Semiconductor Engineering
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The RDL is a layer of wiring metal interconnects that redistribute the I/O access to different parts of the chip and makes it easier to add microbumps to a die.
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... on a thin “reconstituted” or carrier wafer/panel, which is then molded and followed by a redi...
- 2Redistribution Layers (RDLs) - Semiconductor Engineering
The RDL is a layer of wiring metal interconnects that redistribute the I/O access to different pa...
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Redistribution layer:我查詢後感覺是一種重新分配電路的技術，把原本: ... 時，你就會用RDL的方式，在舊的PAD上，多用一層額外的金屬線(metal ...
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Redistribution layer (RDL) is an integral part of 3D IC integration, especially for 2.5D IC integ...
- 5Redistribution layer - Wikipedia
A redistribution layer (RDL) is an extra metal layer on a chip that makes the IO pads of an integ...
