Copper Redistribution Layer | DuPont
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What is Cu RDL? Copper RDL is an interconnect technology used in both fan-in and fan-out wafer level processing. · Meeting Finer Line and Space Requirements.
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- 1晶圓線路重佈 - 瑞峰半導體
小尺寸，低功耗，低成本的高性能產品，為記憶體的RDL加工帶來了強大的市場需求，藉由重新佈線I / O ... 整合設計: Cu RDL與Cu Pillar Bump 或Lead Free Bum...
- 2Solder Bump 製程應用在Wafer Level CSP RDL 結構可靠度 ...
RDL (redistribution layer) 結構是傳統IC 金線封裝wire bonding 轉. 換為覆晶封裝 ... Fig.1.6 : RDL trace are define ...
- 3晶圓級封裝凸塊介電層製程技術之改進 - 高雄應用科技大學
（Cu RDL）技術中，此製程的第一層Polymer 厚度（5 或7.5um），第二 ... improve of WLCSP Bumping polymer process for PI2 l...
- 4Copper Redistribution Layer | DuPont
What is Cu RDL? Copper RDL is an interconnect technology used in both fan-in and fan-out wafer le...
- 5Redistribution layer (RDL) process development and ...
The Cu damascene process is widely applied in BEOL of. IC industry while conventional Cu RDL appr...
