電路板(PCB)名詞中英字義 - 中秋傑

電路板(PCB)名詞中英字義 · D. 壓合Lamination · G. 塞孔(Plug Hole) · J. 噴錫(Hot Air Solder Leveling) · M. 終檢( Final Visual Inspection) · A/W ( ... 關閉廣告 中秋傑 跳到主文 部落格全站分類：不設分類 相簿 部落格 留言 名片 Feb12Sun201214:58 電路板(PCB)名詞中英字義 A.下料(CutLamination)a-1裁板(SheetsCutting)a-2原物料發料(Panel)(ShearmaterialtoSize)     B.鑽孔(Drilling)b-1內鑽(InnerLayerDrilling)b-2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b-4雷射鑽孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔鑽孔(Blind&BuriedHoleDrilling)     C.乾膜製程(PhotoProcess(D/F))c-1前處理(Pretreatment)c-2壓膜(DryFilmLamination)c-3曝光(Exposure)c-4顯影(Developing)c-5蝕銅(Etching)c-6去膜(Stripping)c-7初檢(Touch-up)c-8化學前處理,化學研磨(ChemicalMilling)c-9選擇性浸金壓膜(SelectiveGoldDryFilmLamination)c-10顯影(Developing)c-11去膜(Stripping)     D.壓合Laminationd-1黑化(BlackOxideTreatment)d-2微蝕(Microetching)Developing,Etching&Stripping(DES)d-3鉚釘組合(eyelet)d-4疊板(Layup)d-5壓合(Lamination)d-6後處理(PostTreatment)d-7黑氧化(BlackOxideRemoval)d-8銑靶(spotface)d-9去溢膠(resinflushremoval)     E.減銅(CopperReduction)e-1薄化銅(CopperReduction)     F.電鍍(HorizontalElectrolyticPlating)f-1水平電鍍(HorizontalElectro-Plating)(PanelPlating)f-2錫鉛電鍍(Tin-LeadPlating)(PatternPlating)f-3低於1mil(Lessthan1milThickness)f-4高於1mil(Morethan1milThickness)f-5砂帶研磨(BeltSanding)f-6剝錫鉛(Tin-LeadStripping)f-7微切片(Microsection)     G.塞孔(PlugHole)g-1印刷(InkPrint)g-2預烤(Precure)g-3表面刷磨(Scrub)g-4後烘烤(Postcure)     H.防焊(綠漆):(SolderMask)h-1C面印刷(PrintingTopSide)h-2S面印刷(PrintingBottomSide)h-3靜電噴塗(SprayCoating)h-4前處理(Pretreatment)h-5預烤(Precure)h-6曝光(Exposure)h-7顯影(Develop)h-8後烘烤(Postcure)h-9UV烘烤(UVCure)h-10文字印刷(PrintingofLegend)h-11噴砂(Pumice)(WetBlasting)h-12印可剝離防焊(PeelableSolderMask)     I.鍍金Goldplatingi-1金手指鍍鎳金(GoldFinger)i-2電鍍軟金(SoftNi/AuPlating)i-3浸鎳金(ImmersionNi/Au)(ElectrolessNi/Au)     J.噴錫(HotAirSolderLeveling)j-1水平噴錫(HorizontalHotAirSolderLeveling)j-2垂直噴錫(VerticalHotAirSolderLeveling)j-3超級焊錫(SuperSolder)j-4.印焊錫突點(SolderBump)     K.成型(Profile)(Form)k-1撈型(N/CRouting)(Milling)k-2模具沖(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜邊(BevelingofG/F)     L.短斷路測試(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光學檢查(AOIInspection)l-2VRS目檢(Verified&Repaired)l-3汎用型治具測試(UniversalTester)l-4專用治具測試(DedicatedTester)l-5飛針測試(FlyingProbe)     M.終檢(FinalVisualInspection)m-1壓板翹(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包裝及出貨(Packing&shipping)m-4目檢(VisualInspection)m-5清洗及烘烤(FinalClean&Baking)m-6護銅劑(ENTEKCu-106A)(OSP)m-7離子殘餘量測試(IonicContaminationTest)(CleanlinessTest)m-8冷熱衝擊試驗(ThermalcyclingTesting)m-9焊錫性試驗(SolderabilityTesting)     N.雷射鑽孔(LaserAblation)N-1雷射鑽Tooling孔(LaserablationToolingHole)N-2雷射曝光對位孔(LaserAblationRegistrationHole)N-3雷射Mask製作(LaserMask)N-4雷射鑽孔(LaserAblation)N-5AOI檢查及VRS(AOIInspection&Verified&Repaired)N-6BlaserAOI(afterDesmearandMicroetching)N-7除膠渣(Desmear)N-8微蝕(Microetching)     A/W(artwork)底片Ablation燒溶(laser),切除abrade粗化abrasionresistance耐磨性absorption吸收ACC(accept)允收acceleratedcorrosiontest加速腐蝕acceleratedtest加速試驗acceleration速化反應accelerator加速劑acceptable允收activator活化液activeworkinprocess實際在製品adhesion附著力adhesivemethod黏著法airinclusion氣泡airknife風刀amorphouschange不定形的改變amount總量amylnitrite硝基戊烷analyzer分析儀anneal回火annularring環狀墊圈;孔環anodeslime(sludge)陽極泥anodizing陽極處理AOI(automaticopticalinspection)自動光學檢測applicabledocuments引用之文件AQLsampling允收水準抽樣aqueousphotoresist液態光阻aspectratio縱橫比(厚寬比)Asreceived到貨時     backlighting背光back-up墊板bankedworkinprocess預留在製品basematerial基材baselineperformance基準績效batch批betabackscattering貝他射線照射法beveling切斜邊;斜邊biaxialdeformation二方向之變形black-oxide黑化blankcontroller空白對照組blankpanel空板blanking挖空blip彈開blister氣泡;起泡blistering氣泡blowhole吹孔board-thicknesserror板厚錯誤bondingplies黏結層bow;bowing板彎breakout從平環內破出bridging搭橋;橋接BTO(BuildToOrder)接單生產burning燒焦burr毛邊(毛頭)     camcorder一體型攝錄放機carbide碳化物carlsonpin定位梢carrier載運劑catalyzing催化catholicsputtering陰極濺射法caulplate隔板;鋼板calibrationsystemrequirements校驗系統之各種要求centerbeammethod中心光束法centralprojection集中式投射線certification認證chamfer倒角(金手指)chamfering切斜邊;倒角characteristicimpedance特性阻抗chargetransferoverpotential電量傳遞過電壓chase網框checkboard棋盤chelator蟹和劑chemicalbond化學鍵chemicalvapordeposition化學蒸著鍍circumferentialvoid圓周性之孔破cladmetal包夾金屬cleanroom無塵室clearance間隙coat鍍外表coatingerror防焊覆蓋錯誤coefficientofthermalexpansion(CTE)熱澎脹系數coldsolderjoint冷焊點cold-weld金屬粉末冷焊color顏色colorerror顏色錯誤compensation補償competitiveperformance競爭力績效complexsalt錯化物complexor錯化物componenthole零件孔componentside零件面concentric同心conformance密貼性consumerproducts消費性產品contactresistance接觸電阻continuousperformance連續發揮效能contractservice協力廠controlledsplit均裂式conventionalflow亂流方式conventionaltensiletest傳統張力測試法conversioncoating轉化層convex突出coordinatelist資料清單coppercladedlaminates(CCL)銅箔基板copperexposure線路露銅coppermirror鏡銅copperpad銅箔圓配copperresidue(coppersplash)銅渣corrosionratenumbering腐蝕速率計數系統corrosionresistance抗蝕性coulombslaw庫倫定律countersink喇叭孔coupon試樣couponlocation試樣點coveringpower遮蓋力CPU中央處理器crack破裂;裂痕crazing裂痕;白斑crosslinking交聯聚合crosstalk呼應作用crosslinking交聯crystalcollection結晶收集curing聚合體currentefficiency電流效率cut-outs挖空cutting裁板cyanide氰化物cyclesoflearning學習循環cycle-timereduction交期縮短     datecode週期deburring去毛頭dedicated專用型degradation退變delamination分層dent/pinhole凹陷/針孔departmentofdefense國防部designation字碼簡示法de-smear除膠渣developing顯影dewetting縮錫dewettingtime縮錫時間dimensionerror外形尺寸錯誤dielectricconstant介質常數difficulty困難度difunctional雙功能dimension尺寸dimensionstability尺寸安定性dimensionalstability尺度安定性dimensionandtolerance尺寸與公差dirtyhole孔內異物discolorhole孔黑;孔灰;氧化discoloration變色disposableeyeletmethod消耗性鉚釘法distortionfactor尺寸變形函數doubleside雙面板downtime停機時間drill鑽孔drillbit鑽頭drillfacet鑽尖切萷面drillpointer鑽尖重(研)磨機drilledblankboard已鑽孔之裸板drilling鑽孔dryfilm乾膜ductility延展性     economyofscale經濟規模edgespacing板邊空地edge-boardcontact(goldfinger)金手指efficiency能量效率electrictest電測electricaltesting電測;測試electrochemicalmachineECM電化學加工法electrochemicalreactor電化學反應器electroforming電鑄electrolessplate化學銅electroless-deposition無電鍍electropolishing電解拋光electrorefining電解精鍊electrowinning電解萃取ellipticalset橢圓形embrittlement脆性entitlementperformance可達成績效entrapment電鍍夾雜物epoxy環氧樹酯equipotential電位線errordatafile異常情形etchrate蝕銅速率etchants蝕刻液etchback回蝕evaluationprogram評估用程式exposure曝光externalpinmethod外部插梢法eyelethole鉚釘孔Eyeletting鉚眼     fabric網布failure故障fastresponse快速回應fault瑕庛;缺陷fiberexposure纖維顯露fiberprotrusion纖維突出fiducialmark光學點,基準記號filler填充料film底片filtration過濾finishedboard成品fixing固著fixture電測夾具(治具)flakingoff粹離flammabilityrating燃性等級flare喇叭形孔flatcable併排電纜feedbackloop回饋循環first-in-first-out(FIFO)先進先出flexiblemanufacturingsystem(FMS)彈性製造系統flux助焊劑foildistortion銅層變形fold空泡foreigninclude異物foreignmaterial基材內異物freeradicalchainpolymerization自由基連鎖聚合fullyadditive加成法fullyannealedtype徹底回火軔化之類形function函數fundamentalandbasic基本fungusresistance抗黴性funnelflange喇叭形摺翼     galvanized加法尼化製程gap鑽尖分開gaugelength有效長度geltime膠化時間generalresistink一般阻劑油墨general通論generalindustrial一般性(電子)工業級geometricallevelling幾何平整glasstransitiontemperature(Tg)玻璃態轉換溫度Gold金goldfinger金手指goldplating鍍金goldenboard標準板gouges刷磨凹溝gouging挖破grainboundary金屬晶體之四邊green綠色grip夾頭groundplane接地層groundplaneclearance接地空環     hackers駭客HAL(hotairleveling)噴錫haloing白邊;白圈hardener硬化劑hardness硬度hepafilter空氣濾清器highperformanceindustrial高性能(電子)工業級highreliability高可靠度highresolution高解析度hightemperatureelongation(HTE)高溫延展性銅箔hightemperatureepoxy(HTE)高溫樹酯hit擊holecounter數孔機holediameter孔徑holediametererror孔徑錯誤holelocation孔位holenumber孔數holewallquality孔壁品質hook外弧hotdip熱浸法hullcell哈氏槽hybrid混成積體電路hydrogenbonding氫鍵hydrolysis水解hydrometallurgy濕法冶金法     imageanalysissystem影像分析系統imagetransfer影像轉移immersiongold浸金(化鎳金)immersionplating浸鍍法impedance阻抗infraredreflow紅外線重熔inhibitor熱聚合抑制劑injectionmold射模ink油墨innerlayer&outlayer內外層insulationresistance絕緣電阻intendedposition應該在的位置intensifier增強器intensity強度intermolecularexchange交互改變interconnection互相連通ioniccontaminants離子性污染物ioniccontaminationtesting離子污染試驗IPA異丙醇5I:inspiration(啟蒙)identification確認計劃目標implementation改善方案information數據internalization制度化invisibleinventory無形的庫存     knifeedges刀緣Knoop努普(硬度單位)kraftpaper牛皮紙     laminarflow層流laminate基層板laminating壓合lamination壓合laminator壓膜機land焊墊layback刃角磨損layup組合疊板layout佈線;佈局leadscrew牽引螺絲leakage漏電learningcurve學習曲線legend文字標記leveling平整levellingadditive平整劑levellingpower平整力lifesupport維繫生命limitingcurrent極限電流linespace線距linewidth線寬linearvariabledifferentialtransformer(LVDL)線性可變差動轉換器liquid液狀(態)liquidcrystalresins液晶樹脂liquidphotoimageablesolderresistink液態感光防焊油墨liquidphotoresistink液態光阻劑油墨lotsize批量lowercarrier底部承載板     mechanicalplating機祴鍍法machinescrub刷磨清潔法macrothrowingpower巨分佈力margin鑽頭刃帶marketshare市場佔有率markingerror文字錯誤maskedleveling儰裝平整masslamination大型壓板masstransfer質量傳送效應masstransferoverpotential質量傳遞過電壓masstransportation質傳masterdrawing主圖;藍圖materialusefactor材料使用率mealing泡點;白點memory記憶裝置meniscographsolderabilitymeasurement新月型焊錫效果microetch微蝕microetching微蝕microfocus微焦距microfocussystem微焦距系統microprofile微表面microsectioning微切片法microthrowingpower微分佈力migration遷移mini-tensiletester迷你拉力測試儀misholelocation孔位錯誤misregistration焊錫面與零件面對位偏差misregsitration對不準moistureandinsulationresistancetest濕氣與絕緣電阻試驗moldedcircuitboard(MCB)模製電路板monoethanalamine單乙醇氨monohydratestate水化物monomer單分子膜;單體mousebite鋸齒;蝕刻缺口msec毫秒mufflefurnace高溫焚火爐multichip超大IC型(多晶片模組)mylar保護膜     nailhead釘頭NCdrill數位鑽孔機negativeetchback反回蝕negativefilm負片negativerakeangle負摳耙角network迴路;網路neutralization中和nick缺口nickel鎳nodule銅瘤;瘤粒noflowresin不流樹脂noise雜訊nominal標示nominaldimension標定長度nominalgeltime標示膠性時間nominalresincontent標示膠含量nominalresinflow標示膠流量nominalscaledflowthickness標示比例流量厚度     OAequip辦公室自動化設備obsolescencefactor報廢因素OEM原設備製造商offset-list補償數據清單ohmmeter歐姆計open斷路opencircuits斷路openshorttesting斷短路測試opening開口originalartwork(A/W)原稿底片Others其它outgrowth增出overdesign牛刀殺雞overlap鑽尖重疊overlayentry蓋板overpotential過電壓oxidation氧化oxidetreatment黑化處理oxidedcytochrome氧化性之細包色素oxygenevolution氧氣發生反應     packedbed充填床式pad錫墊;圓配padcopperexposurepad露銅panel小型板面;母板panelplating一次銅電鍍parasitic寄生的partno.料號patternplating二次銅電鍍PCB(printcircuitboard)印刷電路板pcs片peelstrength抗撕強度peelingoff剝離(剝落)performancespecification性能規範permittivity透電率perspectivesonexperience經驗透視PET聚酯photodiodedetector發光二極體偵測器photoinitiator感光啟始劑photoresist光阻phototool光具(指工作底片)piece子板面pincetonappliedresearch腐蝕測定儀pinkring粉紅圈pit凹點pitch腳距planar平面plating電鍍platingexposure下鍍層露出pluggauge插規plughole孔塞PNL(panel)排板polar-polarinteraction極性之間的吸力polyester聚酯類polyglycols聚乙二醇polyimide聚亞醯氨poorbevelling磨邊加工引起突起,剝離poordrill孔形不良poorHAL噴錫不良poormarking字體不良poorpad錫墊不良poorprinted印刷偏差poorsolderability焊錫性不良poortouch-up補線不良positioncontrolsystem位置控制系統positiverakeangle正摳耙角powercurvemodel幕次曲線模式practice工藝慣例preferred良好prematuretearing提前撕裂prepolymer預聚合物prepreg膠片pre-process(front-end)製前press壓床presscycle壓合週期primarycurrentdistribution一次電流分佈primary主要productlifetimes生命週期productprocess製程promoter促進劑protocal初步資料prussicacid普魯士酸PTF-basedprocess厚膜糊法PTH(platingthoughhole)導通孔pullaway拉開pumice浮石粉pumicescrub噴砂清潔法pyrometallurgy火燒法冶鍊     QC(qualitycontrol)品管QFP(quadflatpack)扁方型封裝體qualificationinspection資格審查檢驗qualificationtesting資格檢定qualityclassification品質等級quantitative計量式測試     rack掛架radiometer能量劑rakeangle摳耙角RAM[RandomAccessMemory隨機存取記憶體realtime關鍵時刻recessedtraceprocess凹槽線路法recoverytank回收槽reduction還原re-eninforcement強化refraction折光率reinforcementstyle補強材料的型式registermark對位用標記registrationhole對位孔registrationpattern長方形銅地REJ(reject)退貨;拒收rejectable拒收releaseagent脫模劑reliefangle浮離角remark備註repair修理resincontent樹脂含量(膠含量)resinflow膠流量resinflowpercentage樹脂流量之百分率resinrecession樹脂下陷resinsmear膠渣resiststrippers剝乾膜劑resistornetwork排列電阻resolution解像度returnonassets資產報酬率reversibility可逆性rework重工rosin天然松香rotatingcylinder旋轉圓柱形roughtness孔壁粗糙;粗慥routing切外形,成型routingbit銑刀runout偏轉     S/Lonhole孔內沾文字S/M(soldermask),S/L防焊文字S/M(soldermask)防焊S/Merror防焊種類錯誤S/Monhole孔內綠漆saltspraytest鹽水噴霧試驗samplingsize抽樣數scope範圍scored刻痕scoring樞槽;刮線scrap廢框scratches刮傷screenprinting網版印刷scum透明殘膜sealing封孔處理secondary次要semi-additive半加成法sensitize敏化sensitizer敏化液separator鋼隔板sequentiallamination漸成式壓法serratededges毛邊shatter破碎short短路shunt分路silanetreatment矽烷處理siliconecouplingagent矽烷偶合劑silkscreen文字印刷simulator模擬器singleaxis單軸sizing底片之伸縮補償skip漏印skipprinting跳印;漏印sliver絲條slot開槽slotting開槽SMD(surfacemountdevice)表面黏著元件smear膠渣SMT(surfacemounttechnology)表面黏著技術sodiumcarbonatemonohydrate結晶水碳酸鈉softtooling軟性工具solder焊錫;錫鉛solderbridge錫橋solderbump錫突solderfloat漂錫soldermaskadhesion綠漆附著力solderonG/F金手指沾錫solderontrace線路沾錫solderplug錫塞solderside焊錫面solderability焊錫性solidcarbide實質碳化物spacing間距spacingnonenough間距不足SPC(StatisticalProcessControl)統計生管specification規範specialconsiderations特別考慮spincoating旋轉塗佈spindle鑽軸spiralcontractometer螺旋收縮儀spotface銑靶spraycoating噴塗Squeegee刮刀stackingstructure疊板結構stamping沖壓standardhydrauliclamination標準液壓法standardizing標準化starvation缺膠steptablet格片數stockoption認股選擇權strain應度strength強度stressmeter應力計subtractive減除法surfaceconvex表面突起surfaceexamination表面檢查surfaceinsulationresistance(SIR)表面絕緣電阻surfacemount表面黏著方式surfaceroughness表面粗慥度surges突波switchcircuit開關線路     tab金手指tackfree不黏tapedholegauge錐形孔規targethole靶孔taskforce任務編組tensilestrength抗拉強度tensilestress張性應力tent浮蓋termsanddefinitions術語與定義terminationload抗匹配負載testcircuit測試線路testmethod試驗方法testpoint測試點thermalshock熱震盪試驗thermalstress熱應力試驗thermistor熱電感應式thermocycling熱循環試驗theoreticalcycletime理論性週期時間thickness厚度timetomarket上市時機thicknessdistribution厚度分佈thief補助陰極thincore薄基板;內層板throwingpower分佈力tolerance公差;容差toolinghole工具孔torqueload扭力拒之負載totalqualityprogram全面的品質計劃toughness堅度traceerror線路錯誤tracenick&pinhole線路缺口及針孔tracepeeling線路剝離tracepin-hole線路針孔tracesurfaceroughness線路表面粗糙tarnishandoxideresist抗污抗氧化劑transmittance透光度trimline裁切線truelevelling真平整trueposition真正位置的孔;真位twist板翹type種類     umbra本影undercut側蝕unevencoating噴錫厚鍍不平整universal萬用型universaltensiletester萬用拉力試驗機universaltester汎用型測試機uppercarrier頂部承載鋼uptime稼動時間     vacuumdeposition真空蒸鍍法vacuumhydrauliclamination真空液壓法vaporizer氣化室V-cutV形槽verticalmicrosection垂直微切片viahole導通孔visibleinventory有形的庫存visioninspection目視檢查Void孔破voidinhole孔壁上的破洞voidinPTHhole孔破     walkman隨身聽warehouse倉庫warp板彎warp,warpage板彎waterabsorption吸水性wearresistance耐磨度weaveexposure纖紋顯露weavetexture織紋隱現wedgeangle契尖角week週wetchemistry濕式化學製程wetfilm濕膜wetlamination濕膜壓膜法wetprocess濕製程wetting沾錫wettingbalance沾錫平衡法wicking滲銅;滲入;燈蕊效應width寬度widthreduce線細width-to-thicknessratio寬度與厚度的比值window操作範圍work-in-process在製品workorder工單workingfilm工作片workingmaster工作母片     year年yellow金黃色yield良率     glassystate玻璃狀態rubberystate橡膠狀態trial&error嚐試錯誤SOP標準作業程序EDI(Exchangedatainterface)資料交換介面FTP(filetransferprotocol)檔案傳送協定Website網址WAP(wirelesapplicationprotocol)無線應用協定seriesconnection串聯parallelconnection並聯NPI(newProductintroduction)新產品導入samplequalification打樣認可independentthirdpartyassessment獨立第三者評鑑internalassessment戶(內部)評鑑endproduct完工產品roundingconvention四捨五入之慣例inspectionlot檢驗批targetvalue目標值horizontalmicrosection水平切片orderofprecedence優先順序masterdrawing主圖makingink文字油墨thermalplane散熱層hole-fillinsulationmaterial填孔用絕緣物unsupportedholes非電鍍通孔holepatternaccuracy孔位準度dielectriclayerthickness介質層厚度liftedlands焊墊浮起nail-heading釘頭Platingfolds電鍍皺折tackness沾黏性samplesize樣本數samplingplan抽樣計劃rejectedlots拒收批exteriorcontainers外箱intendeduse主要用途non-flow(no-flow)非流性etchback(whenspecified)回蝕(當指定時才做)         全站熱搜 創作者介紹 chuangjames62 中秋傑 chuangjames62發表在痞客邦留言(4)人氣() E-mail轉寄 全站分類：進修深造個人分類：資訊&知識此分類上一篇：塑膠模具基本知識 此分類下一篇：使用U.V.油墨應知的兩三事 上一篇：塑膠模具基本知識 下一篇：使用U.V.油墨應知的兩三事 歷史上的今天 2012:自用車歷史 2012:單位符號用語 2012:供應鏈管理 2012:陽離子UV油墨的優缺點 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