DDR RDLRDL process flowrdl製程redistribution layer中文rdl中文重分佈製程rdlUBM layerCu RDL processRedistribution layer (RDL)WLCSP process厚銅 - Chipbond Website
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1.2 RDL(Redistribution Layer)線路重佈用於重新安排凸塊的佈局，或改變bond pad ... Cu/Ni/Au RDL: 5.2.3 PI+ Thick Cu/Ni/Au RDL+ PI; 5.3 Process capability ...
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