1. Semiconductor manufacturing process - hitachi-hightech.com

1. Semiconductor manufacturing process. A semiconductor chip is an electric circuit with many components such as transistors and wiring formed on a ... Skiptomaincontent Search Global HitachiGroupProducts&Services HitachiGroupCorporateInformation GlobalNetwork Sitemap ContactUs Products&Services AboutUs Support TOP Products&Services SemiconductorManufacturingEquipment SemiconductorRoom SemiconductorManufacturing 1.Semiconductormanufacturingprocess 1.Semiconductormanufacturingprocess Asemiconductorchipisanelectriccircuitwithmanycomponentssuchastransistorsandwiringformedonasemiconductorwafer.Anelectronicdevicecomprisingnumerousthesecomponentsiscalled“integratedcircuit(IC)”.Thelayoutofthecomponentsispatternedonaphotomask(reticle)bycomputerandprojectedontoasemiconductorwaferinthemanufacturingprocessesdescribedbelow. 1)Waferprocessing Siliconsinglecrystalandsiliconwafers InthemanufacturingprocessofIC,electroniccircuitswithcomponentssuchastransistorsareformedonthesurfaceofasiliconcrystalwafer. BasicsofICformation Athinfilmlayerthatwillformthewiring,transistorsandothercomponentsisdepositedonthewafer(deposition). Thethinfilmiscoatedwithphotoresist.Thecircuitpatternofthephotomask(reticle)isthenprojectedontothephotoresistusingPhotolithographytechnology. Thedevelopedphotoresistisusedasamaskforetchingtoprocessthethinfilmintotheshapeofthewiringandothercomponents. Refertofigure2)Front-endprocessandback-endprocess. Withthis,onelayerofthecircuitisformed.Thetransistorsareformedonthelowestlayer.Similarprocessisthenrepeated,andmanylayersofcircuitsareformedontopofoneanother. PleaseenableJavaScriptinyourbrowsersettingswhenusingthiswebsite. Inordertoreadaflashfile, youneedtohaveAdobe®Flash®Playerinstalledinyourcomputer. Siliconsubstrate(wafer) Intheprocessoftheintegratedcircuitcreation,thereareinspectionandmeasurementstepstocheckwhetherornotthepatternsarefabricatedasdesigned.Ifdefectsarefound,thefabricationwillbeinterruptedtoremovethedefectsfromtheprocessandtomakesmallchangesinthefabricationconditionsforcorrectionpurposes.Morethanonehundredsemiconductordiesarefabricatedonasinglewafer.Atpresent,thelargestsiliconwaferis300mmindiameter.Semiconductormanufacturersarelookinginto450mmdiametersiliconwafersforuseinthefuture. 2)Front-endprocessandback-endprocess Semiconductordevicesarecompletedthroughthefront-endprocess(waferprocessingoperation)andtheback-endprocess(assemblyprocess)describedbelow. (Inthefollowingdescriptionoftheelementprocess,averysmallareaofawafersurfaceismagnifiedandshownschematically.) Front-endprocessandback-endprocess Magnifytheimage. Thefinishedsemiconductordeviceshavebeenusedinavarietyofproductssuchaspersonalcomputers,smartphonesandcarsineverydaylife(seealso“Semiconductorsineverydaylife”). Seetheflowofthefront-endprocessandback-endprocess. Inordertoreadaflashfile,youneedtohaveAdobe®Flash®Playerinstalledinyourcomputer. Page1of7 NextPageLastPage Whataresemiconductors? Propertiesofsemiconductors Semiconductorsineverydaylife Thesemiconductormaterialsilicon Historyofsemiconductors Integratedcircuit(IC) SemiconductorPowerDevicesandMEMS Semiconductormanufacturing Semiconductormanufacturingprocess Semiconductor-MetrologyandInspection Semiconductor-AccuracyandPrecision CD-SEM-WhatisaCriticalDimensionSEM? Waferdefectinspectionsystem ReviewSEM-WhatisaReviewSEM? EtchSystem-WhatisanEtchSystem? Semiconductormanufacturing Glossary pagetop SemiconductorRoomWhataresemiconductors?SemiconductorManufacturing1.Semiconductormanufacturingprocess4.CD-SEM-WhatisaCriticalDimensionSEM? ContactUs RelatedLinks SemiconductorManufacturingEquipment Indexbydevice:HitachiHigh-Tech FieldSolution SemiconductorRoom TermsofUse PrivacyPolicy ©HitachiHigh-TechCorporation.2001,2022.Allrightsreserved.